The effects of c.d., bath temperature and coating thickness on the solderability and wetting balance of Pd coating electroplated on phosphor-bronze were studied. The grain size of Pd is increased with increasing c.d. or bath temperature, but is slightly affected by coating thickness. The solderability of as-plated Pd coatings produced under different process conditions is good. The use of fluxes with different activities affects the solderability and wetting balance of Pd coating. The solderability of steam-aged Pd coating with medium-active rosin flux is better than that with non-active rosin flux.