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最高研发阶段无进展 |
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100 项与 Amkor Technology, Inc. 相关的临床结果
0 项与 Amkor Technology, Inc. 相关的专利(医药)
2024-05-28·2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
Fusing Current Characterization of Various Cu RDL Designs in Wafer Level Packages
作者: Whitchurch, Nathan ; Sohn, EunSook ; Yoon, JiYeon ; Ju, JeongMin ; Park, KyungRok
2024-05-28·2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
Thermal Performance of an Indium-Silver Alloy Metal TIM for a Large Body Lidded FCBGA After EOL and Long-term Reliability Tests
作者: Kim, SangHyuk ; Kweon, YoungDo ; Park, KyungRok ; Sohn, EunSook
2024-05-28·2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
Novel Molded FCBGA Package Platform for Highly Reliable Automotive Applications
作者: Nari.Kim ; Nathan.Whitchurch ; InRak.Kim ; Gayoung.Shin ; Youngdo.Kweon
100 项与 Amkor Technology, Inc. 相关的药物交易
100 项与 Amkor Technology, Inc. 相关的转化医学